Qualcomm Snapdragon 875 SoC Likely to Feature 5G X60 Modem

Qualcomm Snapdragon 875

Details of Qualcomm’s next mobile platform, the Qualcomm Snapdragon 875 is leaked. The chip is expected to be announced later this year when the Snapdragon Summit usually takes place and likely to be found in the top 2021 flagship phones.

Code-named SM8350, the Qualcomm Snapdragon 875 should bring the Kryo 685 cores, based on TSMC’s 5nm N5 process, accompanied by the Adreno 660 GPU and the Spectra 580 ISP. The chip’s performance level is not yet known, but considering the exchange of lithography, at least good gains in energy efficiency are expected.

One of the main features of the platform will be the 5G X60 modem, which will support mmWave and Sub-6 standards. There is still no confirmation as to whether the modem will be integrated or optional, along the lines of the current X55. Other chipset configurations also include:

  • Adreno 665 VPU
  • Quad-channel package-on-package (PoP) LPDDR5 high-speed SDRAM
  • Adreno 1095 DPU
  • Snapdragon Sensors Core technology
  • Qualcomm Secure Processing Unit (SPU250)
  • Low consumption audio subsystem with Aqstic Audio Technologies (codecs WCD9380 and WCD9385)

The Snapdragon 875 is also expected to continue to bring features present in Qualcomm’s current line, such as the possibility for manufacturers to update chip drivers through app stores. Xiaomi was the first to use the technology, launching updates for the Mi 10 line and the Redmi K30 Pro in China.


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